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S-CSP系列

前装产品系列:华引芯自研车规芯片,独家SCSP封装,小尺寸,120°-175°可调发光角,应用场景丰富。(点击蓝色字体可跳转至产品详情页)

Picture Part No. Power(W) Size(mm) Color Test/Max IF(mA) Flux(lm) Tj(℃) Rth(K/W) ESD HBM(KV) Beam Angle(°)
SCSP0808 HGC-S0808A002W60E-BD1 0.2 0.8*0.8*0.45 White 60/100 22-34 150 55 2 140
HGC-S0808A002A18X-BD1 0.2 0.8*0.8*0.45 Amber 60/100 16-22 150 55 2 140
SCSP1313 HGC-S1313A005W60E-CP1 0.5 1.3*1.3*0.7 White 150/250 55-80 150 9.6 8 120
HGC-S1313A005A18X-CP1 0.5 1.3*1.3*0.75 Amber 150/250 45-65 150 9.6 8 120
S1612 HGC-S1612B010W60E-CP1 1.0 1.6*1.2*0.67 White 350/500 135-190 150 5.5 8 120
HGC-S1612B010A18X-CP1 1.0 1.6*1.2*0.75 Amber 350/500 105-160 150 5.8 8 120
S1915 HGC-S1915B030W60E-CG1 3.0 1.9*1.5*0.75 White 1000/1500 370-450 150 4.4 8 120
HGC-S1915B030A18X-CG1 3.0 1.9*1.5*0.75 Amber 1000/1500 200-280 150 4.5 8 120
黄白双芯系列 HGC-S3219D060WA60E-CG1 3.0 3.2*1.9*0.75 White 1000/1500 370-450 150 4.5 8 120
Amber 200-280